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From June 10 to 12, 2026, IDC EXPO 2026 and CIME SHENZHEN 2026 will be grandly held in Halls 14-16 of Shenzhen World Exhibition & Convention Center. Three major exhibitions — Shenzhen International AI Computing Power Industry Exhibition, the 6th Shenzhen International Data Center Liquid Cooling Technology Exhibition, and the 16th Shenzhen International Thermal Conductivity & Heat Dissipation Materials and Equipment Exhibition — will run concurrently. The event covers the entire industrial chain of AI computing power and core tracks of heat dissipation technology.
Dongguan Yisen Precision Hardware Spring Co., Ltd. will showcase a full range of custom spring components and assembly solutions tailored for AI computing power and heat dissipation applications at Booth 16T15, demonstrating its technical expertise and industrial application achievements in high-precision fundamental components.
The exhibition themed *AI-Driven Innovation, Liquid Cooling Empowers the Future* aligns closely with the development trend of the global tech industry. With the rapid adoption of large language models and generative AI, global demand for AI computing power has surged dramatically. Heat dissipation for high-density computing servers has become a major bottleneck restricting industrial development. As an efficient cooling solution, liquid cooling technology is emerging as the mainstream choice for data center construction.
Hosting over 1,000 upstream and downstream enterprises across the industrial chain, the exhibition displays cutting-edge innovations ranging from AI chips and complete servers to liquid cooling systems and thermal management materials. It attracts professional visitors worldwide and stands out as the most influential industry event focusing on AI computing power and heat dissipation in the first half of 2026.
As a leading manufacturer in China’s precision hardware spring industry, all exhibited products are developed to address core pain points in AI computing power and heat dissipation sectors, reflecting the company’s in-depth insight into industrial trends.
In the field of AI servers, we feature fastener springs for CPU heat sinks, contact springs for memory slots, elastic components for PCIe interfaces, and shock-absorbing springs for power modules. Made of high-grade special alloy materials and manufactured under stringent process control and performance testing, these precision springs maintain consistent and uniform contact pressure throughout the server’s service life of over 10 years. They ensure tight bonding between heat sinks and chip surfaces to maximize heat conduction efficiency, effectively resolving heat dissipation issues of high-power AI servers under full load.
To keep pace with the rising power density of AI servers, Yisen has developed a series of customized springs featuring high temperature resistance, superior fatigue resistance and corrosion resistance, catering to personalized requirements of servers with various models and power ratings.
For data center liquid cooling systems, our dedicated liquid cooling spring components are a major highlight at the booth. The product lineup includes sealing springs for quick liquid cooling connectors, pressure regulating springs for valves, shock-absorbing springs for pump bodies and compensation springs for pipelines.
With specialized surface treatment and structural optimization, these components withstand long-term exposure to coolant corrosion and high-pressure operating environments. They deliver precise and reliable elastic compensation to prevent liquid cooling system leakage and ensure stable and secure operation of data centers. Up to now, our liquid cooling springs have established long-term stable partnerships with leading domestic liquid cooling equipment manufacturers, and are widely applied in cold-plate and immersion liquid cooling systems.
We also present spring components for diverse thermal management equipment, including shock-absorbing springs for cooling fans, fixing springs for heat pipes and elastic pressure plates for vapor chambers. These parts effectively absorb vibration and impact during operation, reduce noise and extend the service life of heat dissipation equipment.
Beyond standard products, we offer robust customization services. We provide one-stop solutions covering product design, material selection, process development and mass production to help clients accelerate product launch.
Yisen has long focused on the R&D and production of precision springs and spring assemblies, equipped with advanced production facilities and a professional technical team. A comprehensive quality management system is implemented to conduct strict inspections from raw material procurement to finished product delivery, guaranteeing stable and reliable product quality.
In recent years, we have kept pace with the growth of AI and data center industries, increased R&D investment in heat dissipation solutions and broken through technical barriers, building core competitiveness in the segmented market of heat dissipation springs.
Participation in IDC & CIME 2026 serves as a vital platform for Yisen to showcase technical strength and expand industrial cooperation. In-depth exchanges with industry experts, clients and partners enable us to keep abreast of the latest technological trends and market demands, supporting subsequent product R&D and market layout.
Looking ahead, the continuous evolution of AI technology and steady construction of global data centers will drive sustained growth in market demand for precision springs as key fundamental components. Adhering to the corporate philosophy of **Striving for Perfection, Pursuing Innovation**, Yisen will further enhance technological innovation and product quality, delivering dependable component support for the high-quality development of the global AI computing power and heat dissipation industry.